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| Product Brief Intel TXN17201/17209 (R) 10Gbps XPAK Optical Transceiver Intel(R) optical components are modular building blocks that enable networking and communications equipment manufacturers to create standards-based products with shorter time-to-market and reduced development costs. Developers can use these components to build optical network solutions to meet a variety of high-bandwidth requirements in Ethernet and Fiber Channel Networks. Product Overview The Intel(R) TXN17201/209 10Gbps XPAK Optical Transceiver is a PCI form factor, hot-pluggable module designed for use in high-density data-center applications within local area networks (LANs) and storage area networks (SANs). It is the ideal solution for server network interface cards, enterprise stackable switches, Fibre Channel switches, and Fibre Channel host bus adapters. The Intel(R) TXN17201/209 family of optical transceivers provides an interface between the photonic physical layer and the electrical section layer. The module includes an optical transmitter and receiver pair integrated with Attachment Unit Interface (XAUI)-toserial conversion. The Intel(R) TXN17201 component is an IEEE 802.3ae, draft 5.0-compliant 10GBASE-SR multi-mode transceiver operating at 10.3Gbps for Ethernet applications. It includes Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), and Physical Medium Dependent (PMD) functions. The transmitter section decodes four 8B10B encoded channels at 3.125 Mbps from an XAUI parallel data bus, performs 64B/66B scrambling, and multiplexes the result into a 10.312Gbps Ethernet rate optical signal. The receiver section demultiplexes a single 10Gbps optical signal and converts it to four channels of XAUI. The receiver includes a photodiode, transimpedance amplifier, clock recovery, decision circuit and demultiplexer, and operates over the 850nm band. The Intel(R) TXN17209 component is a 10GFC draft 3.0-compliant 1200-MX-SN-I multi-mode transceiver operating at 10.5Gbps for Fibre Channel applications. It performs the same functions as the Intel(R) TXN17201 component at the 10.51875Gbps Fibre Channel data rate. Intel in Communications Product Brief Intel(R) TXN17201/209 10Gbps XPAK Optical Transceiver Product Overview (continued) The Intel(R) TXN17201/209 transceiver is designed for link spans up to 300m and uses an 850nm Vertical Cavity Surface Emitting Laser (VCSEL). It also includes an IEEE 802.3ae and XPAK MSA-compliant Management Data Interface (MDIO). The Intel TXN17201/209 10Gbps XPAK Optical Transceiver is a standards-based, turnkey solution that improves timeto-market and enables system designers to install and change transceivers during the manufacturing process or in the field, for design flexibility and reduced inventory costs. to ct s ne Bu on rc em t e st In S y P C IX E b G ia 10 ed ss er M e ll cc o A ntr o C X A U ol r t r so on s C ce ro l1 te 20 In 17 X NA TX XP (R) 10GbE Network Interface Card Data Center Server Application P I s p B G .3 d ar 10 C on e ati ac ic rf pl te p In A k er or rv we et S N er Et b en GC 10 ata D Product Highlights s PCI-compatible compact form factor Intel(R) TXN17201 10GBASE-SR multi-mode transceiver -IEEE 802.3ae draft 5.0-compliant -10.3Gbps Ethernet bit rate s Supports link spans up to 300m XPAK Multi Source Agreement (MSA)-compliant Management Data Interface Fully Hot Pluggable s s s s Intel TXN17209 1200-MX-SN-I multi-mode transceiver -10GFC draft 3.0-compliant -10.5Gbps Fibre Channel bit rate (R) 2 Intel(R) TXN17201/209 10Gbps XPAK Optical Transceiver Product Brief I S 4> LA <0 D TA C R P D M ), (N ), IP N A ( ), X BIP (N ) X CIP (N X DIP X I U/ A ve X ei X/ ec U w R eM ke D es D IO D M M O R P E E Features Compact MSA-compatible package: 2.740 inches (l) 1.557 inches (w) 0.465 inches (h) Small cross-section Hot-pluggable front faceplate XPAK MSA-compliant electrical interface: 70-pin board edge connector; standard LC optical connectors Heat sink designed for 45C (ambient) with airflow of 100 linear fpm. A standardized, turnkey solution that improves time-to-market Versatile thermal solution Support Collateral and Tools Item Eval Board ), (N ), 0P (N ), AP X O (N ) B PN X CO P( X DO X / X UIt M AU mi X ns a Tr 0B r /1 de 8B co n E IO t D en /M m Ce Dg M ana M 09 r /1 de 8B co e D FO FI 6/ /6 er r 64 od ble nc m E ra c S X U M FO FI De FC E R sc ram r se e La iod rol D nt o C ut pr ut e O riv D Intel(R) TXN17201/209 SerDes Block Diagram Description Intel(R) TXN1720 Evaluation Board 4r /6 de 66 co e D LK ble r / D eM U X R D C r se er La riv D it sm r an se Tr La de io D Benefits Suitable for PCI card applications Enables up to ten (10) 10Gbps ports on a single line card Enables the system designer to install and change transceivers during manufacturing and in the field for design flexibility and reduced inventory cost op ct Lo le e S R D C ve ie ec N R PI de io D Order Number TXNEB1720 3 Product Brief Intel(R) TXN17201/209 10Gbps XPAK Optical Transceiver Intel Access Developer Web Site Networking Components Home Page Other Intel Support: Intel Literature Center http://developer.intel.com http://developer.intel.com/design/network http://developer.intel.com/design/litcentr 800 548-4725 7am - 7pm CST (USA and Canada) 800 628-8686 or 916 356-3104 5am - 5pm PST General Information Hotline For more information, visit the Intel Web site at: developer.intel.com UNITED STATES AND CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 USA EUROPE Intel Corporation (UK) Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Two Pacific Place 88 Queensway, Central Hong Kong, SAR JAPAN Intel Japan (Tsukuba HQ) 5-6 Tokodai Tsukuba-shi 300-2635 Ibaraki-ken Japan SOUTH AMERICA Intel Semiconductores do Brasil LTDA Av. Dr. Chucri Zaidan, 940-10o andar 04583-904 Sao Paulo, SP Brazil Intel may make changes to specifications and product descriptions at any time, without notice. *Other names and brands may be claimed as the property of others. Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Information in this document is provided in connection with Intel(R) products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Copyright (c) 2002 Intel Corporation. All rights reserved. 0802/ASI/AVM/FPL/5K C Please Recycle 251424-0001 |
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